In addition, recent increase in wireless applications and its growing market are introducing a new set of aggressive design goals for realizing mixed-signal systems.
Here, the designer integrates radio frequency (RF) analog and base band digital circuitry on a single chip.
The goal is to make single-chip radio frequency integrated circuits (RFICs) on silicon, where all the blocks are fabricated on the same chip.
One of the advantages of this integration is low power dissipation for portability due to a reduction in the number of package pins and associated bond wire capacitance.
The problem is severe, since signals of different nature and strength interfere, thus affecting the overall performance, which demands higher clock rates and greater analog precisions.