Zig-zag in-line package

It was intended as a replacement for dual in-line packaging (DIL or DIP).

The package's pins protrude in two rows from one of the long edges.

The pins are inserted into holes in a printed circuit board, with the packages standing at right-angles to the board, allowing them to be placed closer together than DIPs of the same size.

High-power devices (such as high-voltage op-amp ICs, voltage regulators, and motor driver ICs) are still being manufactured in a package with a zig-zag pinout (and normally screwed onto a heatsink).

The trademarks Pentawatt or Hexawatt are also used for chips in multi-leaded power packages like TDA2002/2003/2020/2030 and L200.