As copper and tungsten are not mutually soluble, the material is composed of distinct particles of one metal dispersed in a matrix of the other one.
[3] The CuW75 composite, with 75% tungsten, is widely used in chip carriers, substrates, flanges, and frames for power semiconductor devices.
The penetration is enhanced by factor 1.3 against copper for homogeneous steel target, as both the density and the break-up time are increased.
When the contact is very fine grained (VFG), the electrical conductivity is much higher than a normal piece of copper tungsten.
[7] Copper tungsten materials are often used for arcing contacts in medium to high voltage sulfur hexafluoride (SF6) circuit breakers in environments that can reach temperatures above 20,000K.
The copper tungsten material's resistance to arc erosion can be increased by modifying the grain size and chemical composition.
These properties also let the rods and tubes manufactured for spark erosion be made smaller in diameter and have a longer length since the material is less likely to chip and warp.
After this mixture of copper and tungsten, the ultimate tensile strength then begins to decrease fairly rapidly.