Co-fired ceramic

The starting material is composite green tapes, consisting of ceramic particles mixed with polymer binders.

In RF and wireless applications, LTCC technology is also used to produce multilayer hybrid integrated circuits, which can include resistors, inductors, capacitors, and active components in the same package.

[3] LTCC hybrids have a smaller initial ("non recurring") cost as compared with ICs, making them an attractive alternative to ASICs for small scale integration devices.

This is most common for hybrid circuits where capacitors, inductors, and resistors will all be present and for high operating frequency applications where the hysteresis loop of the ferrite becomes an issue.

Also, the integrated core and windings mean these transformers are not prone to wire break failures in high mechanical stress environments.

[6] Integration of thick-film passive components and 3D mechanical structures inside one module permitted the fabrication of sophisticated 3D LTCC sensors e.g.

It also provides the possibility to fabricate three-dimensional, robust structures enabling in combination with thick film technology the integration of passive, electronic components, such as capacitors, resistors, and inductors into a single device.

LTCC also features the ability to embed passive elements, such as resistors, capacitors and inductors into the ceramic package, minimising the size of the completed module.

The advantages of HTCC in packaging technology includes mechanical rigidity and hermeticity, both of which are important in high-reliability and environmentally stressful applications.