Pin grid array

PGAs are often mounted on printed circuit boards using the through hole method or inserted into a socket.

FC-PGA processors fit into zero insertion force (ZIF) motherboard sockets; similar packages were also used by AMD.

A ceramic pin grid array (CPGA) is a type of packaging used by integrated circuits.

An organic pin grid array (OPGA) is a type of connection for integrated circuits, and especially CPUs, where the silicon die is attached to a plate made out of an organic plastic which is pierced by an array of pins which make the requisite connections to the socket.

Plastic pin grid array (PPGA) packaging was used by Intel for late-model Mendocino core Celeron processors based on Socket 370.

SPGA packages are usually used by devices that require a higher pin density than what a PGA can provide, such as microprocessors.

Closeup of the pins of a pin grid array
The pin grid array at the bottom of prototype Motorola 68020 microprocessor
The pin grid array on the bottom of an AMD Phenom X4 9750 processor that uses the AMD AM2+ socket
Underside of an 80486 with lid removed shows die and wire bonded connections.
The underside of a FC-PGA package (The die is on the other side.)
Demonstration of a PGA-ZIF socket ( AMD 754 )
The topside of a Celeron -400 in a PPGA packing
Underside of a Pentium 4 in a PGA package
An example of a socket for a staggered pin grid array package
View of the socket 7 321-pin connectors of a CPU